Difference between thin & thick film patterns

Thin Film Patterns

Thick Film Patterns

Better pattern accuracyof +/-1%

Normal Pattern accuracyof +/-10%

Higher surface roughness of <0.3um

Poor surface roughness of 1~3um

Goodsurface adhesion in both Al2O3 and AlN

Good surface adhesion in Al2O3 but poor adhesion in AlN

Good alignment accuracy

Poor alignment accuracy

Higher materialstability (Cu layer)

Normal materialstability (Ag and glass mixture)

 

 

 

Conductivity Comparison of Various Materials

Materials

Conductivity(W/mK)

FR4

0.2

Al2O3

17-27

Aluminium Nitride(AlN)

160-230

Gold

315

Silver

425

Copper

398

 

Ceramic metallized: Ti/W,gold(Au), sliver(Ag), Copper(Cu), nickel(Ni)¡K others & produce final circuit

 

  • coating:0.03um to 5mil
  • Ceramic Metallized substrate:
  • Al2O3 substrate metallized
  • AlN substrate metallized
  • Silicon wafer metallized
  • LED heat-dissipation ceramic substrate:
  • LED Al2O3 thin film substrate
  • LED Al2O3 thick film substrate
  • LED AlN thin film heat-dissipation substrate
  • Flip chip substrate
  • The integration of the thin film,thick film,electrode plating and electroless plating processes:

 

Application:

 

1. High Power LED ceramic substrate

2. Microwave (Wireless Communication & Radar)

3. Semiconductor Process Equipment

4. Solar Cell

5. Hybrid Electric Vehicles

6. Flip chip/eutectic substrate

7. Sensor ceramic substrate